The CoolBox COO-TGH3W-3 thermal paste is a compound designed to optimize heat dissipation between electronic components, especially CPUs, memory, and graphic chipsets, significantly improving heat transfer to cooling solutions. Its high-quality formula contains 30% silicone compounds, 20% carbon compounds, and 50% metal oxides, allowing it to achieve a thermal conductivity above 3.17 W/m-K while maintaining a low thermal resistance below 0.0067 °C-in²/W. These technical values ensure efficient performance even under demanding conditions, with operating temperatures ranging from -30 to 240 °C. Additionally, its composition is electrically non-conductive, reducing the risk of short circuits and providing safety during application. This product, containing 2 grams, has a characteristic gray tone due to its materials and provides a thin, uniform layer essential for maximizing heat dissipation and preventing device overheating. The CoolBox COO-TGH3W-3 thermal paste is ideal for both individual users and technicians who require a reliable solution to maintain the operational stability of their electronic components, extending their lifespan. In short, it is a technical product with balanced qualities that guarantees effective and safe heat exchange in electronic cooling systems.
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